SMART CUT™ Hybrid Bond series precision diamond wafering blades are designed to give a smooth surface finish you need from resin bond, and superior long life. Available in different diamond concentrations, mesh sizes, bond hardness, and inside diameters.
Applications: Glass, Optical Materials, Quartz, Glass / Pyrex Tubing, Aluminum oxide, Silicon Nitride, Fused Silica, Bk7, Silicon Carbide, Sapphire, Zirconia, Boron Carbide, Advanced Ceramics, Composites, Medical Devices, and Many Others.