Metallurgical Technology

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Diamond Wafering Blades
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SMART CUT™ Hybrid Bond series precision diamond wafering blades are designed to give a smooth surface finish you need from resin bond, and superior long life. Available in different diamond concentrations, mesh sizes, bond hardness, and inside diameters.

Applications: Glass, Optical Materials, Quartz, Glass / Pyrex Tubing, Aluminum oxide, Silicon Nitride, Fused Silica, Bk7, Silicon Carbide, Sapphire, Zirconia, Boron Carbide, Advanced Ceramics, Composites, Medical Devices, and Many Others.

 

Stock Item:
OD Diameter:TH Thickness:ID (arbor size):Concentration:Order No.:
4" (101.6 mm).014 in.5 inLOW10 10 21
4" (101.6 mm).014 in .5 inHIGH10 10 22
5" (125 mm).015 in.5 inLOW10 10 23
5" (125 mm).015 in.5 inHIGH10 10 24
6" (152.4 mm).020 in.5 inLOW10 10 26
6" (152.4 mm).020 in.5 inHIGH10 10 27
8" (203.2 mm).025 in.5 inLOW10 10 28
8" (203.2 mm).025 in.5 inHIGH10 10 29
10" (254 mm).032 in.5 inLOW10 10 30
10" (254 mm).032 in.5 inHIGH10 10 31
12" (300 mm).051 in.5 inLOW10 10 32
14" (350 mm).051 in.5 inHIGH10 10 33


Diamond Wafer Blade Selection Guidelines:
Material:Characteristic:Speed (rpm)Load (grams)Blade (grit/concentration)
Silicon substratesoft/brittle<300<100Fine/low
Gallium arsenidesoft/brittle<200<100Fine/low
Boron compositesvery brittle500250Fine/low
Ceramic fiber compositesvery brittle1000500Fine/low
Glassesbrittle1000500Fine/low
MIineralsfriable/brittle>1500>500Fine/low
Alumina ceramichard/tough>1500>500Medium / low
Zirconia (PSZ)hard/tough>3500>800Medium / low
Silicone nitridehard/tough>3500>800Medium / low
Metal matrix composites--->3500>500Medium / high
General purpose---variablevariableMedium / high



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